Insight Di Burn-In System

DI Corporation delivers advanced semiconductor test solutions trusted worldwide for reliability and performance.

 

• Burn‑In Systems: Stress devices under controlled temperature and voltage to ensure long‑term reliability.

• Burn‑In Boards : Customizable boards for various package types, including low‑temp, high‑temp, and ceramic options.

• Flexible Testers & Handlers : Adaptable systems for multiple device types, supporting diverse production needs.

• Accessories & Components: Precision sockets, interfaces, and consumables to complete the burn‑in process.

 

MPI Thermal

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Advanced Technology: Precise localized hot & cold testing.

Wide Range: Temperature control from ‑80 °C to 300 °C.

Reliability: Ensures accurate performance in semiconductor environments.

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OKins Socket Pins Tester

Precision Measurement: Accurately evaluates pin force and resistance for reliable socket performance.

Maintenance Solution: Designed to streamline test socket upkeep and extend equipment lifespan.

Ease of Use: Universal socket compatibility with simple setup and intuitive programming.

Data‑Driven Insight: Integrated interface provides real‑time charts and measurement analytics for quality assurance.

 

Power Semiconductor Burn‑In Systems

Precision Measurement: Accurately evaluates pin force and resistance for reliable socket performance.

Maintenance Solution: Designed to streamline test socket upkeep and extend equipment lifespan.

Ease of Use: Universal socket compatibility with simple setup and intuitive programming.

Data‑Driven Insight: Integrated interface provides real‑time charts and measurement analytics for quality assurance.

 

TFE PRC Socket

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Capability: Field‑proven socket technology for large devices (up to 18K PKG) and high‑frequency testing.
Value: Reliable performance across extreme temperature ranges (‑55°C to 160°C), combining durability with forward‑looking design.

ATTEST ADTS – Low‑Cost Capacitive Tester

Defect Detection: Identifies critical assembly issues such as wire sagging, wire sweep, and near shorts.

Integrated Solution: Seamlessly built into the Mirae Test Handler for streamlined operation.

Versatile Use: Compatible with both singulated ICs and strip test systems.

Value Advantage: Combines cost‑effectiveness with enhanced quality control in semiconductor testing.​​​